no code implementations • 26 Jan 2021 • Yandong Sun, Yanguang Zhou, Ramya Gurunathan, Jin-Yu Zhang, Ming Hu, Wei Liu, Ben Xu, G. Jeffrey Snyder
Strain engineering is critical to the performance enhancement of electronic and thermoelectric devices because of its influence on the material thermal conductivity.
Materials Science
no code implementations • 4 Jan 2021 • Ramya Gurunathan, Riley Hanus, Samuel Graham, Anupam Garg, G. Jeffrey Snyder
Both low-angle Si-Si twist boundaries and the Si-Ge heterointerfaces are considered here and compared to previous experimental and simulation results.
Materials Science Applied Physics
