Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology

no code implementations • 27 Jan 2020 • Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari, Daehan Won

In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process.

BIG-bench Machine Learning regression

Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology

no code implementations • 27 Jan 2020 • Irandokht Parviziomran, Shun Cao, Hae-Yong Yang, Seungbae Park, Daehan Won

Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are permanently attached on PCB with the aim of reflow soldering process.

2D Human Pose Estimation Position +1