Search Results for author: Tianshu Hou

Found 2 papers, 0 papers with code

Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires

no code implementations17 May 2022 Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, Hai-Bao Chen

Electromigration (EM) is one of the major concerns in the reliability analysis of very large scale integration (VLSI) systems due to the continuous technology scaling.

A Space-Time Neural Network for Analysis of Stress Evolution under DC Current Stressing

no code implementations29 Mar 2022 Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji, Hai-Bao Chen

The electromigration (EM)-induced reliability issues in very large scale integration (VLSI) circuits have attracted increased attention due to the continuous technology scaling.

Cannot find the paper you are looking for? You can Submit a new open access paper.